As the consumer electronics and semiconductor industries push for smaller, lighter, and thinner devices, manufacturers face a severe packaging bottleneck. Components such as micro-shields, ultra-thin contacts, and coated lenses are incredibly vulnerable. Traditional mechanical taping processes often
In today's fast-paced manufacturing environment, managing multiple isolated machines for feeding, inspection, and tape packaging increases labor costs, floor space requirements, and process complexity. For delicate and surface-sensitive parts, transferring components between separate stations also d
The Double-Layer Inspection Machine is a high-precision automated system designed for inspecting carrier tapes used in SMT production. Equipped with a touchscreen HMI and through-beam sensor technology, it detects product thickness and records OK and NG quantities in real time. Compatible with carrier tape widths from 8mm to 88mm, this machine offers flexible and reliable quality control. With a theoretical speed of 3000 PCS per 4 minutes, it streamlines inspection processes and supports data logging per product model. Ideal for manufacturers seeking efficient, customizable inspection solutions for electronic components.
